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picture1_5 Designconstraintsandpackaging


picture2_5 Designconstraintsandpackaging picture3_5 Designconstraintsandpackaging

 79x       Filetype PPT       File size 0.72 MB       Source: engineering.purdue.edu


File: 5 Designconstraintsandpackaging
Reference: IEEE Spectrum, January 2003 Reference: IEEE Spectrum, January 2003 Instructional Objectives: Instructional Objectives: To gain a better understanding of the real- To gain a better understanding of the real- ...

icon picture PPT Filetype Power Point PPT | Posted on 11 Sep 2022 | 2 years ago
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...Reference ieee spectrum january instructional objectives to gain a better understanding of the real world constraints associated with digital system design project product packaging considerations outline choice logic family voltage swing outputs relative requirements other inputs dcnm current source sink capability fan out speed operation power dissipation functions available price others supply s goes up as square some e g specific codec are only for certain voltages possible need level translation buffers look higher tolerant input availability v part volt complications multiple regulators dc converters etc operating frequency increases linearly know difference between static and dynamic can operate down d c i no minimum clock rate requires different parts circuit may at frequencies microcontrollers have pll that allows convenient changing programming modes ic package dip dual in line facilitates prototyping but larger than necessary surface mount preferred most components is challe...
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