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...Part g solved problems mpe electronics cooling a square silicon chip k w m is of width mm on side and thickness t the mounted in substrate such that its back surfaces are insulated while front surface exposed to coolant if being dissipated circuits what steady state temperature difference between data given dimensions thermal conductivity input power from require across assumptions conductions b constant properties c one dimensional conduction d neglect heat loss sides solution fourier s law q kadt dx or p kat then tp oc ka isothermal well flow at reliability considerations must not exceed air corresponding convection coefficient h maximum allowable dielectric liquid for which conditions transferred by radiation uniform according newton hat ha max comment comparison both it appears transfer poorer than but with higher cost case transistor length l diameter cooled an stream under maintains average dissipation base top use impinging jets proposed as means effectively high logic chips com...